Shenzhen Tunsing Releases DS8400 Polyurethane Hot Melt Adhesive Film: Latest Technical Parameters and Performance Curves

Shenzhen Tunsing Plastic Products Co., Ltd. has officially updated its technical product data sheet (Version V1.4) for the DS8400 Hot Melt Adhesive Film. As a high-performance, thermoplastic polyurethane-based adhesive film, DS8400 delivers advanced bonding capabilities backed by comprehensive laboratory testing, differential scanning calorimetry (DSC), and rheological characterization curves.

The DS8400 is a thermoplastic film-like hot melt adhesive engineered to undergo repeated heating, plasticization, and bonding, and it comes supported on protective release paper. It balances strong mechanical bonding properties with ideal processability, offering several distinct performance benefits:

• Excellent Substrate Adhesion: Demonstrates exceptional bonding strength on textiles, TPU, PC, and PVC.
• Superior Ergonomics: Provides a soft, comfortable hand feel along with robust material resilience.
• Extreme Environmental Endurance: Offers excellent cold resistance, maintaining structural integrity under low temperatures.

Due to its versatile material compatibility, DS8400 is widely used to bond structural components in clothing, embroidery, footwear, luggage, handbags, toys, hat making, and sporting goods.

According to standardized testing conducted by the Tunsing Laboratory, the physical properties of the DS8400 hot melt adhesive film are categorized as follows:

To maximize peel strength and ensure visual quality, Tunsing recommends the following foundational parameters for dual-stage laminations:

• First Lamination: Mechanical mold temperature of 120-150°C, a dwell time of 5-15 seconds, and a uniform pressure of 0.3-0.6 MPa.
• Second Lamination: Mechanical mold temperature of 130-160°C, a dwell time of 8-25 seconds, and a uniform pressure of 0.3-0.6 MPa.

Processing Notice: Bonding temperature, pressure, and time are deeply related to the final bonding strength of the hot melt adhesive film on the material. The bonding temperature must stay close to the temperature set by the machine, the pressure must remain completely uniform, and the mold or press rolls must be entirely smooth and flat. Because conditions vary heavily across different machinery and materials, these parameters serve as a basic guideline; the ideal setup should be established through real-world manufacturing trials for your specific application.

To assist engineering teams with precise process integration, Tunsing has provided deep-dive analytical testing charts within the latest product update:

Using a NETZSCH DSC 214 analyzer under a protective nitrogen atmosphere and a standard heating rate of 10°C/min, the film was evaluated across a temperature range from -80°C to 200°C:

1. Glass Transition Temperature (Tg): A distinct endothermic effect occurs near -31.1°C, defining the film's operating glass transition point.
2. Melting Point (Tm): A clear endothermic peak is observed near 96.5°C, indicating the active melting temperature of the hot melt adhesive batch. (Note: Test data across batches may fluctuate minimally within the standard 80-105°C melting range).

Using an Anton Paar Rotational Rheometer in a dynamic parallel plate mode, a sinusoidal strain was applied to track the material's structural transition:

1. Viscoelastic Tracking: The energy storage modulus (G', representing elasticity), loss modulus (G'', representing viscous loss), and complex viscosity (η*) were tracked at a controlled heating rate of 2.5°C/min. Both storage modulus and viscosity decreased predictably as temperature increased.
2. Solid-to-Fluid Transition Point: By technical convention, the exact temperature where the storage modulus (G') and loss modulus (G'') intersect marks the transition of the adhesive film from a viscoelastic solid to a viscoelastic fluid. For DS8400, this critical flow transition temperature is approximately 98.1°C.