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East Sun New Material Technology (Shenzhen) Co., Ltd. 86-0755-89960062
Adhesive Polyamide Powder

Adhesive Polyamide Powder

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    Adhesive Polyamide Powder


    TPU Polyamide Powder


    150μm Heat Transfer Adhesive Powder

  • Color
  • Composition
    Polyamide TPU
  • Appearance
  • Melt Point(DSC)
    105-130 ℃
  • Melt Flow Index
    42±3 G/10min
  • Washable Property
    40 ℃
  • Powder Size Range
    0-80μm; 80-200μm;150-250μm
  • Density
    1.10±0.02 G/cm³
  • Packaging
    20KG In One PE Bag+Brown Paper
  • Place of Origin
  • Brand Name
  • Certification
    Rosh, Reach
  • Model Number
  • Minimum Order Quantity
  • Price
  • Packaging Details
  • Delivery Time
    3-8 working day
  • Payment Terms
  • Supply Ability

Adhesive Polyamide Powder

Adhesive Polyamide Powder
Adhesive Polyamide Powder Good Washable For Heat Transfer
Product model: ES212
Description:The product is polyamide thermoplastic powder hot melt adhesive.It has excellent processability.It has good adhesion and good washing resistance to textile fabrics.
Function: Heat transfer,Silk screen printing.
Physical Characteristics:

Property Criterion
Appearance White powder
Composition TPU
Density ASTM D-792 1.10±0.02 g/cm³
Melt Point DSC 105-130 ℃
Melt Index ASTM D-1238 42±3 g/10min
Powder size range 0-80 um
0-170 um
80-200 um
150-250 um

Technical Parameters:

Bonding parameters (for reference only) Temperature 135℃
Press 0.5-1.5 kg/cm2
Time 14S
Washing Resistance 40℃ Excellent
60℃ /
90℃ /


Packaging and Storage Conditions:

Packaging 20KG in one PE bag+Brown paper bag
Storage Conditions Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.

1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.
2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

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