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LukasAbby, thank you for your attention. The PU powder quality is good.
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WisnuWe have tested the DTF powder. The quality is very very good. We will order 2000kg.
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Tamerthank you good stuff received
80μm Heat Transfer Adhesive Powder

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xColor | White | Composition | Copolyester |
---|---|---|---|
Appearance | White Powder | Melt Point(DSC) | 105-115 ℃ |
Melt Flow Index | 30±7 G/10min | Washable Property | 40℃ Excellent 60℃ Good 90℃Ordinary |
Powder Size Range | 0-80μm; 80-170 μm;150-250 μm | Density | 1.20±0.02 G/cm³ |
Packaging | 20KG In One PE Bag+Brown Paper | ||
High Light | 80μm Heat Transfer Adhesive Powder,170μm Heat Transfer Adhesive Powder,80μm Polyester Hot Melt Powder |
80μm Heat Transfer Adhesive Powder
Polyester Hot Melt Adhesive Powder In Textile
Product model: ES203
Description:This product is a copolyester thermoplastic powdery hot melt adhesive. Soft hand feel and certain resilience, excellent processability. Excellent adhesion to textiles, PVC, PC
Function:Heat transfer,Silk screen printing.
Physical Characteristics:
Property | Criterion |
Appearance | White powder |
Composition | Copolyester |
Density ASTM D-792 | 1.20±0.02 g/cm³ |
Melt Point DSC | 105-115 ℃ |
Melt Index ASTM D-1238 | 30±7 g/10min |
Powder size range | 0-80 um |
80-170 um | |
150-250 um |
Technical Parameters:
Bonding parameters (for reference only) | Temperature | 125-140℃ |
Press | 1.5-3.0kg/cm2 | |
Time | 10-18S | |
Washing Resistance | 40℃ | Excellent |
60℃ | Good | |
90℃ | / |
Packaging and Storage Conditions:
Packaging | 20KG in one PE bag+Brown paper bag |
Storage Conditions | Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed. |
1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.
2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.