• East Sun New Material Technology (Shenzhen) Co., Ltd.
    Abby, thank you for your attention. The PU powder quality is good.
  • East Sun New Material Technology (Shenzhen) Co., Ltd.
    We have tested the DTF powder. The quality is very very good. We will order 2000kg.
  • East Sun New Material Technology (Shenzhen) Co., Ltd.
    thank you good stuff received
Contact Person : Abby
Phone Number : +8618924647036
WhatsApp : +8618924647036

Adhesive Polyamide Powder

Place of Origin China
Brand Name Easun
Certification Rosh, Reach
Model Number ES212
Minimum Order Quantity 20KG
Price Negotiable
Packaging Details 20KG/bag
Delivery Time 3-8 working day
Payment Terms T/T
Supply Ability 4000000

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Product Details
Color White Composition Polyamide TPU
Appearance Powder Melt Point(DSC) 105-130 ℃
Melt Flow Index 42±3 G/10min Washable Property 40 ℃
Powder Size Range 0-80μm; 80-200μm;150-250μm Density 1.10±0.02 G/cm³
Packaging 20KG In One PE Bag+Brown Paper
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Adhesive Polyamide Powder


TPU Polyamide Powder


150μm Heat Transfer Adhesive Powder

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Product Description

Adhesive Polyamide Powder
Adhesive Polyamide Powder Good Washable For Heat Transfer
Product model: ES212
Description:The product is polyamide thermoplastic powder hot melt adhesive.It has excellent processability.It has good adhesion and good washing resistance to textile fabrics.
Function: Heat transfer,Silk screen printing.
Physical Characteristics:

AppearanceWhite powder
Density ASTM D-7921.10±0.02 g/cm³
Melt Point DSC105-130 ℃
Melt Index ASTM D-123842±3 g/10min
Powder size range0-80 um
0-170 um
80-200 um
150-250 um

Technical Parameters:

Bonding parameters (for reference only)Temperature135℃
Press0.5-1.5 kg/cm2
Washing Resistance40℃Excellent


Packaging and Storage Conditions:

Packaging20KG in one PE bag+Brown paper bag
Storage ConditionsStored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.

1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.
2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

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