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TPU Hot Melt Adhesive Powder
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PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

Brand Name: Easun
Model Number: ES225
MOQ: 20KG
Price: Negotiable
Payment Terms: T/T
Supply Ability: 4000000
Detail Information
Place of Origin:
China
Certification:
Rosh, Reach
Color:
White
Composition:
Polyurethane
Appearance:
Powder
Melt Point(DSC):
100-120 ℃
Melt Flow Index:
20±5 G/10min
Washable Property:
40 ℃
Powder Size Range:
0-80 μm; 80-200 μm;150-250 μm
Density:
1.18±0.03 G/cm³
Hardness:
75±2 Shore A
Packaging:
20KG In One PE Bag+Brown Paper
Product Type:
TPU Hot Melt Adhesive Powder
Packaging Details:
20KG/bag
Supply Ability:
4000000
Product Description

PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

 

Product model: ES225

 

TPU Hot Melt Adhesive Powder Description:  hot melt adhesive powder of thermoplastic polyurethane. It has a soft feel and good resilience, stretching;  easy processing; It has excellent bonding properties for textiles.

 

Function:Heat transfer,Digital printing,Silk screen printing.

 

Physical Characteristics:

 

Property Criterion
Appearance White powder
Composition TPU
Density ASTM D-792 1.18±0.03 g/cm³
Melt Point DSC 100-120 ℃
Melt Index ASTM D-1238 75±2 Shore A
Powder size range 0-80 um
80-200 um
150-250 um

 

Technical Parameters:

 

Bonding parameters (for reference only) Temperature 115-130℃
Press 0.5-1.5 kg/cm2
Time 8-15S
Washing Resistance 40℃ Excellent
60℃ /
90℃ /

 

Packaging and Storage Conditions:

Packaging 20KG in one PE bag+Brown paper bag
Storage Conditions Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.


1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.

2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

 

PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer 0

PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer 1