Tahan Cuci Panas Meleleh Lem Bubuk TPU Titik Leleh Rendah
Detail Produk
| Keywords: | Hot Melt Glue Powder | Komposisi: | TPU |
|---|---|---|---|
| Kepadatan ASTM D-792: | 1,18±0,03 g/cm³ | Titik Leleh DSC: | 100-120 ℃ |
| Kekerasan ASTM D-2240: | 75±2 Pantai A | Indeks Leleh ASTM D-1238: | 20±5 g/10 mnt |
| Kisaran ukuran bubuk: | 0-80 μm,80-200 μm,150-250 μm | Ketahanan Cuci: | 40 ℃ |
| Menyoroti |
RoHS Hot Melt Glue Powder,REACH Hot Melt Glue Powder,Bubuk TPU Titik Leleh Rendah |
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Deskripsi Produk
Ketahanan Cuci Bubuk Lem Panas Meleleh Titik Leleh Rendah TPU
Aplikasi Bubuk Lem Panas Meleleh
ES225 digunakan dalam tekstil dan garmen, pencetakan perpindahan panas, pasta perpindahan panas, pasta berkelompok dan pasta bronzing.
| Properti | Kriteria |
| Penampilan | Bubuk hitam |
| Komposisi | TPU |
| Kepadatan ASTM D-792 | 1,20±0,02 g/cm³ |
| Titik Leleh DSC | 95-115 ℃ |
| Indeks Leleh ASTM D-1238 | 30±7 g/10 mnt |
| Kekerasan | 80±3 Pantai A |
| Kisaran ukuran bubuk | 0-80 μm |
| 80-200 μm | |
| Ketahanan terhadap menguning (level) | / |
Paket Bubuk Lem Panas Meleleh
Sorotan Produk
Ketahanan Cuci Bubuk Lem Panas Meleleh Titik Leleh Rendah TPU Aplikasi Bubuk Lem Panas Meleleh ES225 digunakan dalam tekstil dan garmen, pencetakan perpindahan panas, pasta perpindahan panas, pasta berkelompok dan pasta bronzing. Bubuk Lem Panas Meleleh Properti Kriteria Penampilan Bubuk hitam ...
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Heat Transfer 80μm 170μm PES Powder Copolyester Powder Fabric Glue Copolyester Hot Melt Adhesive Powder Product Description 1. This is copolyester thermoplastic hot melt adhesive powder with conventional size 0-80 μm,80-170 μm. 2. This product has excellent adhesion and good washing resistance to textile products. Copolyester Hot Melt Adhesive Powder Physical Characteristics: Property Criterion Keywords Copolyester Hot Melt Adhesive Powder Density ASTM D-792 1.20±0.02 g/cm³
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