PA poliamida Heat Transfer Glue Powder kopoliamida termoplastik
Detail Produk
| Komposisi: | C0-PA | Kepadatan ASTM D-792: | 1,10±0,02 g/cm³ |
|---|---|---|---|
| Titik Leleh DSC: | 120-130 ℃ | Indeks Leleh ASTM D-1238: | 25±5 g/10 mnt |
| Suhu: | 130-160 ℃ | Tekan: | 1,5-3,0 kg/cm2 |
| Waktu: | 10-18 S | Washing Resistance: | 90℃ Good |
| Kata kunci: | bubuk poliamida | ||
| Menyoroti |
PA poliamida Heat Transfer Glue Powder,Bubuk Lem Panas Meleleh Termoplastik,Bubuk Lem Panas Meleleh Kopoliamida |
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Deskripsi Produk
PA Poliamida Heat Transfer Glue Powder Thermoplastic Copolyamide
Parameter Teknis Serbuk Poliamida
|
Parameter Ikatan ( hanya referensi) |
Suhu | 130-160 ℃ |
| Tekan | 1,5-2,5 kg/cm2 | |
| Waktu | 10-18 S | |
| Ketahanan Cuci | 40 ℃ | Bagus sekali |
| Ketahanan Cuci | 60 ℃ | Besar |
| Ketahanan Cuci | 90℃ | Bagus |
Aplikasi Serbuk Poliamida:
Paket Bubuk Poliamida:
Detail Kemasan: 20kg / tas.
Detail Pengiriman: Pengiriman dalam 1-2 hari setelah pembayaran untuk sampel.
Untuk jumlah besar 3-10 hari yang tergantung pada jumlah pesanan pelanggan.
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Sorotan Produk
PA Poliamida Heat Transfer Glue Powder Thermoplastic Copolyamide Parameter Teknis Serbuk Poliamida Parameter Ikatan ( hanya referensi) Suhu 130-160 ℃ Tekan 1,5-2,5 kg/cm2 Waktu 10-18 S Ketahanan Cuci 40 ℃ Bagus sekali Ketahanan Cuci 60 ℃ Besar Ketahanan Cuci 90℃ Bagus Aplikasi Serbuk Poliamida: ...
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