Bubuk Perekat Panas Meleleh Poliamida PA
Detail Produk
| Keyword: | PA Hot melt Adhesive Powder | Kepadatan ASTM D-792: | 1,10±0,02 g/cm³ |
|---|---|---|---|
| Titik Leleh DSC: | 120-130 ℃ | Indeks Leleh ASTM D-1238: | 25±5 g/10 mnt |
| Kisaran ukuran bubuk: | 0-80μm,80-170 μm,100-400 μm | Temperatur Ikatan: | 130-160 ℃ |
| Ketahanan Cuci: | 90℃ | Kemasan: | 20KG/TAS |
| Menyoroti |
poliamida PA Hot Melt Perekat Powder,170μm PA Hot Melt Perekat Powder,PA poliamida Powder |
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Deskripsi Produk
Poliamida PA Bubuk Perekat Meleleh Panas
PA Hot Melt Adhesive Powder Grosir Poliamida Untuk Perpindahan Panas
Produk ini adalah perekat panas meleleh bubuk kopoliamida termoplastik.Produk ini memiliki daya rekat yang sangat baik, ketahanan yang sangat baik terhadap pencucian dan pembersihan kering untuk kategori tekstil.
PA Bubuk Perekat Meleleh Panas Karakteristik Fisik:
| Properti | Kriteria |
| Penampilan | bubuk putih |
| Komposisi | C0-PA |
| Kepadatan ASTM D-792 | 1,10±0,02 g/cm³ |
| Titik Leleh DSC | 120-130 ℃ |
| Indeks Leleh ASTM D-1238 | 25±5 g/10 mnt |
| Kisaran ukuran bubuk | 0-80 μm |
| 0-120μm | |
| 0-160 μm | |
| 80-170 μm | |
| 80-300 μm | |
| 100-400 μm |
Sorotan Produk
Poliamida PA Bubuk Perekat Meleleh Panas PA Hot Melt Adhesive Powder Grosir Poliamida Untuk Perpindahan Panas Produk ini adalah perekat panas meleleh bubuk kopoliamida termoplastik.Produk ini memiliki daya rekat yang sangat baik, ketahanan yang sangat baik terhadap pencucian dan pembersihan kering ...
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